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傳聞· Apple更新於 1 小時前
社群流傳 iPhone 18 Pro 主機板細節，疑似揭露 A20 Pro 晶片設計
社群帳號 reptalicant 分享了據稱為 iPhone 18 Pro 的主機板細節，並指出 A20 Pro 晶片可能採用 WMCM 封裝技術來優化散熱。
開啟完整故事→ iPhone 18 Pro 傳聞16/100
早期線索
AI 摘要
網路流傳的拆解圖示暗示未來的 iPhone 旗艦機型可能調整記憶體排列方式，並配備更強大的 NPU 單元。
為什麼重要
若關於晶片封裝方式與 LP6 記憶體的傳聞屬實，這代表 iPhone 18 Pro 將在熱量管理與人工智慧運算能力上有顯著提升。
可信度原因
來源為社群帳號，非官方正式消息，應視為初期愛好者觀察而非既定事實。
來源證據
- Source · X postView original postLoading original post…
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