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傳聞· Apple更新於 1 小時前
知名科技帳號 @techinfosocials (X) 指出 iPhone 18 Pro 或將搭載 A20 Pro 晶片與全新散熱板架構
據知名媒體 @techinfosocials (X) 爆料，Apple 可能在 iPhone 18 Pro 系列中捨棄雙層主機板設計，轉而採用新型散熱機制以優化 A20 Pro 晶片的效能表現。
開啟完整故事→ iPhone 18 Pro 傳聞39/100
+9 今日值得留意
AI 摘要
內部消息暗示 Apple 正在針對 iPhone 18 Pro 研發全新的熱能管理方案，據稱將改變 SoC 與 DRAM 的封裝堆疊方式，以解決長期以來的散熱瓶頸。
為什麼重要
高效能晶片極度依賴優異的散熱系統，若此架構調整屬實，將有助於 A20 Pro 在高負載下維持穩定頻率，減少過熱降頻現象。
可信度原因
該消息源於 X 平台上的科技媒體帳號，但內容涉及尚未發布的遠期產品，仍應謹慎看待。
來源證據
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