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傳聞· Apple更新於 2 小時前
內幕消息指 iPhone 18 Pro 主機板設計或能解決過熱問題
社群帳號分享的資訊暗示 iPhone 18 Pro 可能採用 WMCM 封裝技術，透過調整記憶體位置來提升散熱效能。
開啟完整故事→ iPhone 18 Pro 傳聞32/100
+22 今日初步觀察
AI 摘要
根據社群平台流出的說法，未來的 A20 Pro 晶片可能藉由封裝架構的改變，針對 iPhone 長期以來的散熱瓶頸進行優化。
為什麼重要
若關於 A20 Pro 的傳聞屬實，這將代表 Apple 在旗艦機型的硬體溫控管理上邁出重要的一步。
可信度原因
消息來自未經證實的社群帳號，屬於早期爆料性質。
來源證據
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