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Rumor· AppleUpdated 2h ago
Insider leak points to iPhone 18 Pro motherboard design focused on heat reduction
A community source suggests that the iPhone 18 Pro may feature a redesigned motherboard using WMCM packaging to relocate memory for better cooling.
Open full story→ iPhone 18 Pro Rumor32/100
+22 todayInitial watch
AI summary
Recent claims shared on social media suggest the A20 Pro chip might adopt new chip packaging technology to address long-standing thermal issues in Apple's pro handsets.
Why this matters
If these rumors regarding the A20 Pro are accurate, it could signify a major shift in how Apple manages heat dissipation in its flagship devices.
Confidence reason
The source is an unverified community account sharing a leak without official documentation.
Evidence
- Source · X postView original postLoading original post…
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