Rumor· Apple· Published Jun 29, 2026

Insider leak points to iPhone 18 Pro motherboard design focused on heat reduction

A community source suggests that the iPhone 18 Pro may feature a redesigned motherboard using WMCM packaging to relocate memory for better cooling.

Rumor32/100
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How is confidence evaluated?

DNA Brief

Signal Summary

Recent claims shared on social media suggest the A20 Pro chip might adopt new chip packaging technology to address long-standing thermal issues in Apple's pro handsets.

Why It Matters

If these rumors regarding the A20 Pro are accurate, it could signify a major shift in how Apple manages heat dissipation in its flagship devices.

DNA Read

The source is an unverified community account sharing a leak without official documentation.

Evidence

Start with the primary evidence, then review supporting sources and context.

1 items

Primary Evidence

1
This Signal is part of a Story

iPhone 18 Pro

Corroborated· Apple· 89/100
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  1. 9to5Mac 報導 iOS 27 測試版暗示 iPhone 18 Pro 將縮減動態島尺寸
    Jun 17
    1
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