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發展中· Apple更新於 2 小時前
MacRumors 報導 A20 Pro 洩漏影像暗示 iPhone 18 Pro 性能提升
根據 MacRumors 報導，網路流傳的 A20 Pro 主機板影像顯示 Apple 可能採用新的封裝技術，旨在優化散熱並提高人工智慧運算能力。
發展中52/100
可靠線索
AI 摘要
外流的硬體組件資訊顯示，iPhone 18 Pro 的晶片設計可能從傳統堆疊方式轉為將記憶體移至側邊，這有助於降低高負載下的發熱問題。
為什麼重要
封裝技術與 NPU 規格的潛在變動，意味著未來的旗艦手機將能更穩定地執行高效能 AI 任務，同時解決機身發燙的困擾。
可信度原因
消息來源引述了供應鏈相關的技術細節，且與台積電 2 奈米製程的時間表相符。
來源證據
- MacRumorsPrimaryLeaked A20 Pro Image Hints at iPhone 18 Pro Performance Gains尚待驗證
"Leaked A20 Pro Image Hints at iPhone 18 Pro Performance Gains Monday June 29, 2026 4:57 am PDT by Tim Hardwick An alleged image of the iPhone 18 Pro motherboard has leaked online, "
開啟原始來源