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Developing· AppleUpdated 2h ago
MacRumors reports A20 Pro leak points to hardware upgrades for iPhone 18 Pro
MacRumors noted that a surfaced image of the A20 Pro motherboard suggests Apple is moving to WMCM packaging to improve thermal management and AI processing.
Developing52/100
Credible lead
AI summary
Internal components for the future iPhone 18 Pro appear to indicate a shift in chip design, utilizing a new architecture that separates memory from the main processor for better heat dissipation.
Why this matters
These architectural changes could solve thermal throttling issues and provide the necessary power for more advanced on-device artificial intelligence features.
Confidence reason
The report cites multiple known leakers and technical specifications regarding TSMC's upcoming manufacturing processes.
Evidence
- MacRumorsPrimaryLeaked A20 Pro Image Hints at iPhone 18 Pro Performance GainsVerification pending
"Leaked A20 Pro Image Hints at iPhone 18 Pro Performance Gains Monday June 29, 2026 4:57 am PDT by Tim Hardwick An alleged image of the iPhone 18 Pro motherboard has leaked online, "
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